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STM32WL33C8 Datasheet(PDF) 40 Page - STMicroelectronics

Part # STM32WL33C8
Description  Multiprotocol LPWAN 32-bit MCU Arm® Cortex®-M0 2(G)FSK, 4(G)FSK, ASK, D-BPSK, up to 256KB flash, 32KB SRAM
PDF  91 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

STM32WL33C8 Datasheet(HTML) 40 Page - STMicroelectronics

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6.3
Operating conditions
6.3.1
Operating range
Table 10. Operating range
Parameter
Min.
Typ.
Max.
Unit
Operating battery supply voltage (VBAT)
1.7
3.3
3.6
V
Operating ambient temperature range
-40
25
+105
°C
6.3.2
Thermal properties
The maximum chip junction temperature (TJmax.) must never exceed the values in general operating conditions.
The maximum chip-junction temperature, TJ max., in degrees Celsius, can be calculated using the equation:
TJmax.=TAmax.+ PDmax×θJA
(1)
where:
•
TA max. is the maximum ambient temperature in °C
•
ΘJA is the package junction-to-ambient thermal resistance, in °C/W
•
PD max. is the sum of PINT max. and PI/O max. (PD max. = PINT max. + PI/O max.)
•
PINT max. is the product of IDD and VDD, expressed in Watts. This is the maximum chip internal power
PI/O max represents the maximum power dissipation on output pins:
•
PI/O max. = Σ (VOL × IOL) + Σ ((VDD – VOH) × IOH)
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the applications.
Table 11. Thermal data
Symbol
Parameter
Value
Unit
QJA
Thermal resistance junction-ambient VFQFPN48 - 6 mm x 6 mm
25.1
°C/W
Thermal resistance junction-ambient VFQFPN32 - 5 mm x 5 mm
26.9
STM32WL33xx
Electrical characteristics
DS14221 - Rev 5
page 40/91



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