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SPSB081 Datasheet(PDF) 10 Page - STMicroelectronics

Part # SPSB081
Description  Automotive power management IC with LIN and CAN-FD
PDF  137 Pages
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

SPSB081 Datasheet(HTML) 10 Page - STMicroelectronics

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Item
Parameter
Condition
Values
Unit
Power output pin
OUT2
HBM(2)
±4
kV
Power output pin
OUT3
HBM(2)
±4
kV
Power output pin
OUT4
HBM(2)
±4
kV
Transceiver
LIN
HBM(2)
±8
kV
Indirect ESD(3)
±8
kV
Direct ESD(4)
±6
kV
Transceiver
CAN_H
HBM(2)
±8
kV
Direct ESD(4)
±6
kV
Transceiver
CAN_L
HBM(2)
±8
kV
Direct ESD(4)
±6
kV
Pins (5)
Corner pins
CDM (values for corner pins in brackets)
±500/(±750)
V
1. HBM (human body model, 100 pF, 1.5 kW) according to AEC-Q100-002.
2. HBM with all none zapped pins grounded.
3. Indirect ESD test according to IEC 61000-4-2 (150 pF, 330 Ω) and ‘hardware requirements for LIN, CAN and flexray
interfaces in automotive applications’ (version 1.3, 2012-05-04).
4. Direct ESD test according to IEC 61000-4-2 (150 pF, 330 Ω) and ‘hardware requirements for LIN, CAN and Flexray
interfaces in automotive applications’ (version 1.3, 2012-05-04).
5. CDM (charged device model) according to AEC-Q100-011.
Table 4. Transient immunity ratings according to ISO 7637-2
Parameter Value Unit
ISO 7637-2 and IEC 62215-3 transients immunity according to
“OEM_HW_Requirements_For_CAN_LIN_FR-Interfaces_V1.3_2012” and IBEE EMC test
specifications (1) (LIN and CAN)
Pulse1
-100
V
Pulse2a
+75
V
Pulse3a
-150
V
Pulse3b
+100
V
1. ISO 7637 is a system level transient test. Different system level configurations may lead to different results.
2.3
Temperature ranges and thermal data
Table 5. Temperature ranges and thermal data
Symbol
Parameter
Condition
Min
Typ
Max
Unit
Item
TAMB
Operating temperature (ECU environment)
-
-40
-
125
°C
F.019
TJ
Operating junction temperature
-
-40
-
175
°C
F.020
TSTG
Storage temperature
-
-55
-
150
°C
F.021
TW ON(1)
Thermal over temperature warning threshold
-
140
-
160
°C
F.022
TSD1 OFF(1)
Thermal shut-down junction temperature 1
-
165
-
185
°C
F.023
TSD2 OFF(1)
Thermal shut-down temperature
-
175
-
195
°C
F.024
TSD12HYS(1)
Thermal shut-down temperature hysteresis
-
-
5
-
°C
F.025
tfTjTW
Thermal warning/shut-down filter time
Tested by scan
24
32
43
µs
F.026
RTH JAMB(2)
Thermal resistance junction-to-ambient
-
-
38
-
°C/W
F.027
SPSB081
Temperature ranges and thermal data
DS14048 - Rev 3
page 10/137



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