Maximum ratings

M41T11

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DocID6103 Rev 12

4

Maximum ratings

Stressing the device above the rating listed in the absolute maximum ratings table may

cause permanent damage to the device. These are stress ratings only and operation of the

device at these or any other conditions above those indicated in the operating sections of

this specification is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

Caution:

Negative undershoots below –0.3 V are not allowed on any pin while in the battery backup

mode.

Caution:

Do NOT wave solder SOIC to avoid damaging SNAPHAT® sockets.

Table 4. Absolute maximum ratings

Symbol

Parameter

Value

Unit

TA

Ambient operating temperature

–40 to 85

°C

TSTG

Storage temperature (VCC off, oscillator off)

SNAPHAT®

–40 to 85

°C

SOIC

–55 to 125

TSLD

(1)

1. Lead-free (Pb-free) lead finish: reflow at peak temperature of 260°C (the time above 255°C must not

exceed 30 seconds).

Lead solder temperature for 10 seconds

260

°C

VIO

Input or output voltages

–0.3 to 7

V

VCC

Supply voltage

–0.3 to 7

V

IO

Output current

20

mA

PD

Power dissipation

0.25

W