OPAX170 datasheet(8/60 Pages) TI2

8 / 60 page

OPA172, OPA2172, OPA4172

SBOS618I – DECEMBER 2013 – REVISED MAY 2018

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Product Folder Links: OPA172 OPA2172 OPA4172

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package Thermal Metrics application

report.

7.4 Thermal Information: OPA172

THERMAL METRIC(1)

OPA172

UNIT

D (SOIC)

DBV (SOT-23)

DCK (SC70)

8 PINS

5 PINS

RθJA

Junction-to-ambient thermal resistance

126.5

227.9

285.2

°C/W

RθJC(top)

Junction-to-case(top) thermal resistance

80.6

115.7

60.5

°C/W

RθJB

Junction-to-board thermal resistance

67.1

65.9

78.9

°C/W

ψJT

Junction-to-top characterization parameter

31.0

10.7

0.8

°C/W

ψJB

Junction-to-board characterization parameter

66.6

65.3

77.9

°C/W

RθJC(bot)

Junction-to-case(bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package Thermal Metrics application

report.

7.5 Thermal Information: OPA2172

THERMAL METRIC(1)

OPA2172

UNIT

D (SOIC)

DGK (VSSOP)

DRG (WSON)

8 PINS

RθJA

Junction-to-ambient thermal resistance

116.1

158

63.2

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

69.8

48.6

63.5

°C/W

RθJB

Junction-to-board thermal resistance

56.6

78.7

36.5

°C/W

ψJT

Junction-to-top characterization parameter

22.5

3.9

1.4

°C/W

ψJB

Junction-to-board characterization parameter

56.1

77.3

36.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

6.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC package Thermal Metrics application

report.

7.6 Thermal Information: OPA4172

THERMAL METRIC(1)

OPA4172

UNIT

D (SOIC)

PW (TSSOP)

14 PINS

RθJA

Junction-to-ambient thermal resistance

82.7

111.1

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

42.3

40.8

°C/W

RθJB

Junction-to-board thermal resistance

37.3

54.1

°C/W

ψJT

Junction-to-top characterization parameter

8.9

3.8

°C/W

ψJB

Junction-to-board characterization parameter

53.3

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

OPAX170 Datasheet(PDF) 8 Page - Texas Instruments

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