Figure 7. Forward voltage drop versus forward current

I (A)

F

1

10

100

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

V (V)

F

Tj = 25 °C

(maximum values)

Tj = 125 °C

(typical values)

Tj = 125 °C

(maximum values)

Figure 8. Thermal resistance junction to ambient versus

copper surface under each lead (SMB)(typical values)

0

50

100

150

200

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

SMB

S(Cu)(cm²)

Epoxy p ri nted ci rcuit board FR4, coppe r t hickness: 35 µm

STPS3150-Y

Characteristics (curves)

DS7256 - Rev 2

page 4/9