5.4 Thermal Information - OPA134

THERMAL METRIC(1)

OPA134

UNIT

D (SOIC)

P (PDIP)

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

160

73

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

75

50

°C/W

RθJB

Junction-to-board thermal resistance

60

36

°C/W

ΨJT

Junction-to-top characterization parameter

9

17

°C/W

ΨJB

Junction-to-board characterization parameter

50

35

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

5.5 Thermal Information - OPA2134

THERMAL METRIC(1)

OPA2134

UNIT

D (SOIC)

P (PDIP)

8 PINS

8 PINS

RθJA

Junction-to-ambient thermal resistance

160

71

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

75

50

°C/W

RθJB

Junction-to-board thermal resistance

60

36

°C/W

ΨJT

Junction-to-top characterization parameter

9

16

°C/W

ΨJB

Junction-to-board characterization parameter

50

35

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

5.6 Thermal Information - OPA4134

THERMAL METRIC(1)

OPA4132

UNIT

D (SOIC)

14 PINS

RθJA

Junction-to-ambient thermal resistance

97

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

56

°C/W

RθJB

Junction-to-board thermal resistance

53

°C/W

ΨJT

Junction-to-top characterization parameter

19

°C/W

ΨJB

Junction-to-board characterization parameter

46

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

OPA134, OPA2134, OPA4134

SBOS058B – DECEMBER 1997 – REVISED NOVEMBER 2024

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