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STPSC8H065 Datasheet(PDF) 8 Page - STMicroelectronics |
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STPSC8H065 Datasheet(HTML) 8 Page - STMicroelectronics |
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8 / 16 page ![]() 2.2 D²PAK package information • Epoxy meets UL94, V0. • Cooling method: by conduction (C) Figure 13. D²PAK package outline Note: This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. STPSC8H065 D²PAK package information DS9225 - Rev 8 page 8/16 |
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