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8002 Datasheet(PDF) 2 Page - VECTOR ELECTRONICS AND TECHNOLOGY, INC.

Part # 8002
Description  Prototyping Boards (Circbord®)
PDF  4 Pages
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Manufacturer  VECTOR [VECTOR ELECTRONICS AND TECHNOLOGY, INC.]
Direct Link  https://www.vectorelect.com/
Logo VECTOR - VECTOR ELECTRONICS AND TECHNOLOGY, INC.

8002 Datasheet(HTML) 2 Page - VECTOR ELECTRONICS AND TECHNOLOGY, INC.

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Specifications subject to change without notice.
ELECTRONIC COMPANY
VECTORBORD®
3677-6
4.5" x 8.08"
Circuit Pattern:
3-Hole Solder Pad
Contacts:
N/A
Width/Thick:
8.08"/.062"
Height:
4.50"
16-Pin DIP Capacity:
21
Material:
CEM-1
Solder Terminals:
T42-1
Wire-Wrap Terminals:
T44, T46, T49, T68
Wire-Wrap Socket Pins:
R32
Hole Diameter:
.042"
Circuit Pattern:
Ground Plane
Contacts:
N/A
Width/Thick:
6.50"/.062"
Height:
4.50"
16-Pin DIP Capacity:
50
Material:
CEM-1
Solder Terminals:
T42-1
Wire-Wrap Terminals:
T44, T46, T49, T68
Wire-Wrap Socket Pins:
R32
Hole Diameter:
.042"
8007
4.5" x 6.5"
Circuit Pattern:
Pad-Per-Hole/
Ground Plane
Contacts:
N/A
Width/Thick:
6.50"/.062"
Height:
4.50"
16-Pin DIP Capacity:
60
Material:
CEM-1
Solder Terminals:
T42-1
Wire-Wrap Terminals:
T44, T46, T49, T68
Wire-Wrap Socket Pins:
R32
Hole Diameter:
.042"
• Pad-Per-Hole pattern on
component side - overall
Ground Plane pattern on
wiring side
• To commit wire-wrap pins to
ground planes, use Vector T124
solder washers, available
separately
• 0.080" diameter, isolated solder
pad around holes, component
side
• Accommodates any type DIP IC
device or discrete component
• Plane and pad surfaces solder-
coated for user convenience
8004
4.5" x 6.5"
• To commit wire-wrap pins to
voltage and ground planes, use
Vector T124 solder washers,
available separately
• 0.085" diameter clearance
around holes
• Etched overall ground plane on
wiring side only
• Plane surfaces solder-coated
for user convenience
• I/O area with solder pads for
mounting connector
• Unique circuit pattern features
full voltage and ground planes
on opposite sides with isolated,
plated-thru holes
• 0.080" diameter, isolated solder
pad around holes, component
side
• Plane surfaces solder-coated
for user convenience
• SMD cap positions for discrete
decoupling capacitors
Circuit Pattern:
Pads & Planes
Contacts:
N/A
Width/Thick:
6.50"/.062"
Height:
4.50"
16-Pin DIP Capacity:
70
Material:
FR4 Epoxy Glass
Solder Terminals:
T42-1
Wire-Wrap Terminals:
T44, T46, T49, T68
Wire-Wrap Socket Pins:
R32
Hole Diameter:
.042"
8008
4.5" x 6.5"
• Etched circuit pattern on wiring
side only
• 0.080" diameter, isolated solder
pad around holes, both sides
• 3-hole solder pads
(0.028" X 0.080") for
interconnecting multiple
component leads
• Pad and bus surfaces solder-
coated for user convenience
Prototyping Boards (Circbord®)



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