CVH160808H SERIES

Multilayer Power Chip Inductors

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OGEN

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Specifications are subject to change without notice.

Users should verify actual device performance in their specific applications.

The products described herein and this document are subject to specific legal disclaimers

as set forth on the last page of this document, and at www.bourns.com/docs/legal/

disclaimer.pdf.

Product Dimensions

DIMENSIONS:

MM

(INCHES)

Recommended Layout

Tp = Maximum peak package body temperature

Tc = The classification temperature

Tp should be equal to or less than Tc

Refer to IPC/JEDEC J-STD-020E

Solder Reflow Recommendations

Profile Feature

Pb Free Assembly

Preheat

- Temperature Min. (Tsmin)

- Temperature Max. (Tsmax)

- Time(ts) from Tsmin to Tsmax

150 °C

200 °C

60-120 seconds

Ramp-up Rate (TL to Tp)

3 °C/second max.

Liquidous temperature (TL)

217 °C

Time (tL) maintained above TL

60-150 seconds

Peak package body temperature (Tp)

260 °C

Time within 5 °C of Actual Peak Temperature (tp)

<30 seconds

Ramp-Down Rate (Tp to TL)

6 °C/second max.

Time 25 °C to Peak Temperature

8 minutes max.

25

260

Time (Seconds)

REFLOW TIMES: 3 TIMES MAX.

PREHEAT AREA

MAX. RAMP UP RATE = 3 °C/SEC.

MAX. RAMP DOWN RATE = 6 °C/SEC.

Time 25 °C to Peak

8 Minutes Max.

TC -5 °C

200 °C

60~150

Sec.

217

150°C

60~120

Sec.

<30 Sec.

0.6

(.024)

1.9

(.075)

1.6 ± 0.2

(.063 ± .008)

0.8 ± 0.2

(.031 ± .008)

0.8

(.031)

MAX.

1.0

(.039)

0.4 ± 0.2

(.016 ± .008)

0.6

(.024)

1.9

(.075)

1.6 ± 0.2

(.063 ± .008)

0.8 ± 0.2

(.031 ± .008)

0.8

(.031)

MAX.

1.0

(.039)

0.4 ± 0.2

(.016 ± .008)

SIDE VIEW

SIDE VIEW