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ADA4433-1BCPZ-R2 Datasheet(PDF) 24 Page - Analog Devices |
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ADA4433-1BCPZ-R2 Datasheet(HTML) 24 Page - Analog Devices |
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24 / 25 page ![]() ADA4432-1/ADA4433-1 Data Sheet Rev. E | Page 24 of 25 OUTLINE DIMENSIONS Figure 58. 8-Lead Lead Frame Chip Scale Package [LFCSP] 3 mm × 3 mm Body and 0.75 mm Package Height (CP-8-21) Dimensions shown in millimeters Figure 59. 6-Lead Small Outline Transistor Package [SOT-23] (RJ-6) Dimensions shown in millimeters 2.44 2.34 2.24 TOP VIEW 8 1 5 4 0.30 0.25 0.20 BOTTOM VIEW PIN 1 INDEX AREA SEATING PLANE 0.80 0.75 0.70 1.70 1.60 1.50 0.203 REF 0.05 MAX 0.02 NOM 0.50 BSC EXPOSED PAD 3.10 3.00 SQ 2.90 PIN 1 INDICATOR (R 0.15) FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COPLANARITY 0.08 0.50 0.40 0.30 COMPLIANT TO JEDEC STANDARDS MO-229-WEED 0.20 MIN COMPLIANT TO JEDEC STANDARDS MO-178-AB 10° 4° 0° SEATING PLANE 1.90 BSC 0.95 BSC 0.60 BSC 6 5 1 2 3 4 3.00 2.90 2.80 3.00 2.80 2.60 1.70 1.60 1.50 1.30 1.15 0.90 0.15 MAX 0.05 MIN 1.45 MAX 0.95 MIN 0.20 MAX 0.08 MIN 0.50 MAX 0.30 MIN 0.55 0.45 0.35 PIN 1 INDICATOR |
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