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TSI200B1 Datasheet(PDF) 6 Page - STMicroelectronics |
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TSI200B1 Datasheet(HTML) 6 Page - STMicroelectronics |
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6 / 9 page ![]() TSIxxB1 6/9 Symbol Parameter Value Unit IPP Non repetitive peak on-sate current (see note 1) 10/1000 µs (open circuit voltage wave shape 10/100 µs) 5/310 µs (open circuit voltage wave shape 10/700 µs) 2/10 µs (open circuit voltage wave shape 2/10 µs) 30 40 75 A IF Maximum DC current 0.2 A ITSM Non repetitive surge peak on-state current tp=20ms t=1s 5 3.5 A Tstg Tj Storage temperature range Maximum junction temperature - 55 to +150 150 °C TL Maximum lead temperature for soldering during 10 s 260 °C ABSOLUTE MAXIMUM RATINGS (Tamb = 25°C) Note 1 : Pulse waveform : 10/1000 µst r=10µstp=1000µs 5/310 µst r=5µstp=310µs 2/10 µst r=2µstp=10µs 100 50 %I PP t t r p 0 t Symbol Parameter Value Unit Rth(j-a) Junction to ambient 170 °C/W THERMAL RESISTANCE Symbol Parameter VRM Stand-off voltage VBO Breakover voltage VBR Breakdown voltage IH Holding current IBO Breakover current IRM Leakage current at VRM IPP Peak pulse current C Capacitance αT Temperature coefficient ELECTRICAL CHARACTERISTICS (Tamb=25°C) V I V RM BO V RM I H IBO PP I I |
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