Analog Integrated Circuit Device Data

Freescale Semiconductor

19

33897/A/B/C/D/T

REVISION HISTORY

REVISION HISTORY

REVISION

DATE

DESCRIPTION OF CHANGES

9.0

5/2005

• Converted to Freescale format

• Added A & B Versions

• Updated Device Variation Table, and Note “* Recommended device for all new designs”

• Added EF (Pb-Free) Devices, and higher soldering temperature

10.0

8/2005

• Implemented Revision History page

• Updated Simplified Application Diagrams

• Updated Typical Application Schematic

11.0

12/2005

• Added 33897C and D versions and Timing Diagrams

12.0

1/2006

• Updated Table 4, Static Electrical Characteristics - LOAD and BUS parameters

• Updated Ordering Information.

13.0

6/2006

• Removed “Unless otherwise noted” from Static Electrical Characteristics & Dynamic

Electrical Characteristics table introductions

14.0

8/2006

• Added 33897T to Table 1, Device Variations on Page 3, Referencing Electrical Changes

per Errata MC33897TER, Revision 3 and specifying ESD variations

15.0

10/2006

MC33897DLEF/R2, and PC33897DLEF/R2

MCZ33897BEF/R2, and MCZ33897DEF/R2

to the Ordering Information block on Page 1.

• Updated Device Variations on page 3 for “T” suffix products

• Split out Human Body Model on page 6 to differentiate between T and non-T versions

• Added Undervoltage Hysteresis on page 7

• Removed Peak Package Reflow Temperature During Reflow (solder reflow) parameter

from Maximum Ratings on page 6. Added note with instructions to obtain this information

from www.freescale.com.

16.0

6/2007

• Removed watermark, “Advance Information” from page 1.