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MF1ICS7001 Datasheet(PDF) 2 Page - NXP Semiconductors |
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MF1ICS7001 Datasheet(HTML) 2 Page - NXP Semiconductors |
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2 / 7 page ![]() 101731 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 3.1 — 18 April 2007 2 of 7 NXP Semiconductors MF1 IC S70 01 Standard 4Kbyte card IC 3.4 Passivation • Type: sandwich structure • Material: PSG / Nitride(on top) • Thickness: 500 nm / 600 nm 3.5 Bond pads • Pad size: – LA,LB 118 × 118 µm1 – TESTIO 95 × 110 µm2 – VSS 108 × 108 µm2 • Material: Al-Cu • Thickness: 0.85 µm Remark: Substrate is connected to VSS. 1.Passivation window: 90 x 90 µm 2. Pads VSS and TESTIO are disconnected when wafer is sawn. |
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