ISL95810

FN8090 Rev.3.01

Page 3 of 14

Jun 5, 2020

Absolute Maximum Ratings

Thermal Information

Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C

Voltage at Any Digital Interface Pin

with Respect to VSS . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC+0.3

VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to +6V

Voltage at Any DCP Pin with

Respect to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC

Lead Temperature (Soldering, 10s) . . . . . . . . . . . . . . . . . . . . +300°C

IW (10s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±6mA

Thermal Resistance (Typical)

JA (°C/W) JC (°C/W)

8 Ld DFN Package (Notes 4, 5) . . . . . . . . .

48

6

8 Ld MSOP Package (Notes 6, 7) . . . . . . . .

151

50

Recommended Operating Conditions

Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C

Extended Range . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +105°C

VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 5.5V

Power Rating of Each DCP . . . . . . . . . . . . . . . . . . . . . . . . . . . .5mW

Wiper Current of Each DCP. . . . . . . . . . . . . . . . . . . . . . . . . .±3.0mA

Pb-Free Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” can cause permanent damage to the device. This is a stress only rating and operation of the

device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

NOTES:

4.

JA is measured in free air with the component mounted on a high-effective thermal conductivity test board with direct attach features. See

TB379.

5. For

JC, the case temperature location is the center of the exposed metal pad on the package underside.

6.

JA is measured in free air with the component mounted on a high-effective thermal conductivity test board. See TB379.

7. For

JC, the case temperature location is taken at the package top center.

Analog Specifications

Over recommended operating conditions unless otherwise stated.

PARAMETER

SYMBOL

TEST CONDITIONS

MIN

TYP

(Note 8)

MAX

UNIT

RH to RL Resistance

RTOTAL

W, U versions respectively

10, 50

kΩ

RH to RL Resistance Tolerance

-20

+20

%

Wiper Resistance

RW

VCC = 3.3V at +25°C

Wiper current = VCC/RTOTAL

70

200

Ω

Potentiometer Capacitance

(Note 22)

CH/CL/CW

10/10/25

pF

Leakage on DCP Pins (Note 22)ILkgDCP

Voltage at pin from GND to VCC

0.1

1

µA

VOLTAGE DIVIDER MODE (0V at RL; VCC at RH; measured at RW, unloaded)

Integral Non-Linearity

INL (Note 13)-1

1

LSB (Note 9)

Differential Non-Linearity

DNL (Note 12) Monotonic over all tap positions

W option -0.75

-0.75

LSB (Note 9)

U option

-0.5

-0.5

LSB (Note 9)

Zero-Scale Error

ZSerror

(Note 10)

W option

0

1

7

LSB (Note 9)

U option

0

0.5

2

Full-Scale Error

FSerror

(Note 11)

W option

-7

-1

0

LSB (Note 9)

U option

-2

-0.5

0

Ratiometric Temperature Coefficient

TCV

(Notes 14,

15 22)

DCP Register set to 80 hex

±4

ppm/°C

RESISTOR MODE (Measurements between RW and RL with RH not connected, or between RW and RH with RL not connected)

Integral Non-Linearity

RINL

(Note 19)

DCP register set between 20 hex and FF hex.

Monotonic over all tap positions

-1

1

MI (Note 16)

Differential Non-Linearity

RDNL

(Note 12)

DCP register set between 20 hex

and FF hex. Monotonic over all tap

positions

W option -0.75

-0.75

MI (Note 16)

U option

-0.5

-0.5

MI (Note 16)

Offset

Roffset

(Note 17)

W option

0

1

7

MI (Note 16)

U option

0

0.5

2

MI (Note 16)

Resistance Temperature Coefficient

TCR

(Notes 20,

21, 22)

DCP register set between 20 hex and FF hex

±165

ppm/°C