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24FC08 Datasheet(PDF) 34 Page - Microchip Technology |
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24FC08 Datasheet(HTML) 34 Page - Microchip Technology |
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34 / 49 page  24AA08/24LC08B/24FC08 DS20001710N-page 34 2002-2021 Microchip Technology Inc. RECOMMENDED LAND PATTERN Dimension Limits Units Optional Center Pad Width Optional Center Pad Length Contact Pitch Y2 X2 1.50 1.60 MILLIMETERS 0.50 BSC MIN E MAX Contact Pad Length (X8) Contact Pad Width (X8) Y1 X1 0.85 0.25 Microchip Technology Drawing No. C04-129-MN Rev. B NOM 8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN] 12 8 C Contact Pad Spacing 2.90 Thermal Via Diameter V Thermal Via Pitch EV 0.30 1.00 BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: C E X1 Y1 Y2 X2 EV EV ØV SILK SCREEN With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN) |
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