24FC08-ESLASHST datasheet(44/49 Pages) MICROCHIP

44 / 49 page

24AA08/24LC08B/24FC08

DS20001710N-page 44

 2002-2021 Microchip Technology Inc.

APPENDIX A: REVISION HISTORY

Revision N (08/2021)

Added 24FC08 and Q6B package Automotive product

offerings; Removed CSP product offering; Updated

DFN and SOT-23 package drawings.

Revision M (03/2021)

Replaced terminology “Master” and “Slave” with “Host”

and “Client” respectively. Changed “MUY” with “Q4B”

part number for UDFN package. Updated TSSOP and

UDFN package drawings. Added Automotive Product

Identification System.

Revision L (12/2019)

Added the 24FC08 device; Updated Package

Drawings; Updated formating throughout for clarifica-

tion.

Revision K (03/2012)

Added Chip Scale package; Revised Table 1-1, Table

2-1; Product Identification System.

Revision J (02/2009)

Moved Pin Descriptions to Section 2.0, renumbered

remaining sections. Added Figure 5-2.

Revision H (03/2008)

Added TDFN package.

Revision G (02/2007)

Replaced Package Drawings.

Revision F (02/2007)

Updated Device Selection Table; Features section;

Changed 1.8V to 1.7V throughout document; Revised

Electrical

Characteristics Ambient

Temperature;

Replaced Package Drawings; Revised Product ID

System.

Revision E (09/2005)

Revised Figure 3-1: Control Byte Allocation; Figure 4-1

Byte Write; Figure 4-2 Page Write; Section 6.0 Write

Protection; Figure 7-1 Current Address Read; Figure

7-2 Random Read; Figure 7-3 Sequential Read; 8.3

Write-Protect (000-3FF).

Revision D (02/2005)

Added DFN package.

Revision C (12/2003)

Corrections to Section 1.0, Electrical Characteristics.

Section 9.1, 24LC08B standard marking code.

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