5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Peak pulse

MMBZ15VCL - IEC 61643-321 Power (tp = 10/1000µs) at 25°C

40

W

Peak pulse

MMBZ15VCL - IEC 61643-321 Current (tp = 10/1000µs) at 25°C

1.9

A

Peak pulse

MMBZ27VCL - IEC 61643-321 Power (tp = 10/1000µs) at 25°C

35

W

Peak pulse

MMBZ27VCL - IEC 61643-321 Current (tp = 10/1000µs) at 25°C

1

A

Ptot

Total Power Dissipation (Tamb ≤ 25 °C)

500

mW

TA

Operating free-air temperature

-55

150

°C

Tstg

Storage temperature

-65

155

°C

(1)

Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated

under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

5.2 ESD Ratings - JEDEC Specification

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/

JEDEC JS-001

± 2500

V

Charged device model (CDM), per JEDEC

specification JS-002

± 1000

5.3 ESD Ratings - IEC Specification

VALUE

UNIT

V(ESD)

Electrostatic discharge

IEC 61000-4-2 Contact Discharge, all pins

±30000

V

IEC 61000-4-2 Air-gap Discharge, all pins

±30000

5.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

TA

Operating free-air temperature

-55

150

°C

5.5 Thermal Information

THERMAL METRIC(1)

MMBZxxVCL

UNIT

DBZ ( SOT-23)

3 PINS

RθJA

Junction-to-ambient thermal resistance

190.5

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

129.3

°C/W

RθJB

Junction-to-board thermal resistance

79.2

°C/W

ΨJT

Junction-to-top characterization parameter

50.9

°C/W

ΨJB

Junction-to-board characterization parameter

78.4

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

MMBZ15VCL, MMBZ27VCL

SLVSKB1 – DECEMBER 2025

www.ti.com

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