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OPA591DBVR Datasheet(PDF) 26 Page - Texas Instruments

Part # OPA591DBVR
Description  OPAx591 85V, Precision (1μV/°C), Low-Power (450μA), High-Slew Rate (100V/μs) Op Amps With MUX-Friendly Inputs
PDF  39 Pages
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Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments

OPA591DBVR Datasheet(HTML) 26 Page - Texas Instruments

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7.4.1.1 Thermal Considerations
Through normal operation, the op amps can self-heat. Self-heating is a natural increase in the die junction
temperature that occurs in every amplifier. This self-heating is a result of several factors, including quiescent
power consumption, package thermal resistance, PCB layout, and device operating conditions.
Operate the OPAx591 within the rated junction temperature, TJ, range to avoid thermal shutdown. Use the
Equation 6 to determine the estimated TJ
TJ=PD × RθJA+TA
(6)
In a quiescent state, PD is given by the product of the power supply and the quiescent current of the op
amp. Equation 7 shows the calculation of TJ for the OPAx591 assuming an 85V power supply is used and an
operating temperature of 25°C.
TJ= 85V ×550μA ×165.4°CW+25°C
(7)
TJ=32.73°C
(8)
The low power consumption of the OPAx591 causes minimal self-heating even in a small SOT23-5 package as
given by Equation 8. In a loaded condition, PD is equal to addition of the quiescent power, PDQ and the power
dissipated by the output stage, PDL. The worst-case condition is given when the output voltage is equal to ½
of either supply rail (assuming symmetrical supplies, V+ and V-). In a worst-case condition, PDL is given by
Equation 9.
PDL= V+ 24×RL
(9)
For example, assume the OPAx591 is powered with bipolar ±42.5V power supplies and drives a 5kΩ load, RL, to
ground. The maximum increase in TJ is expected to be about 22°C as given by Equation 10. In this example, to
keep the op amp within the Absolute Maximum Ratings, operate in TA well under 128°C to account for different
factors.
∆TJ= 46.75mW+90.3mW ×165.4°CW
(10)
For high-voltage amplifiers such as the OPAx591, the junction temperature can easily be tens of degrees
higher than the ambient temperature in a quiescent (unloaded) condition. As shown by Equation 6, the junction
temperature depends on the thermal properties of the package, as expressed by the junction-to-ambient thermal
resistance (RϴJA).
Temperature (
C)
90 95 100 105 110 115 120 125 130 135 140 145 150
0
10
20
30
40
50
Unloaded
10k
2k
Figure 7-9. OPA591 (SOT23-5) Thermal Safe
Operating Area
Temperature (
C)
50
60
70
80
90
100 110 120 130 140 150
0
10
20
30
40
50
Unloaded
10k
2k
Figure 7-10. OPA2591 (VSSOP-8) Thermal Safe
Operating Area
OPA591, OPA2591
SBOSA47A – FEBRUARY 2026 – REVISED SEPTEMBER 2026
www.ti.com
26
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Copyright © 2026 Texas Instruments Incorporated
Product Folder Links: OPA591 OPA2591



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