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OPA591DBVR Datasheet(PDF) 26 Page - Texas Instruments |
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OPA591DBVR Datasheet(HTML) 26 Page - Texas Instruments |
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26 / 39 page ![]() 7.4.1.1 Thermal Considerations Through normal operation, the op amps can self-heat. Self-heating is a natural increase in the die junction temperature that occurs in every amplifier. This self-heating is a result of several factors, including quiescent power consumption, package thermal resistance, PCB layout, and device operating conditions. Operate the OPAx591 within the rated junction temperature, TJ, range to avoid thermal shutdown. Use the Equation 6 to determine the estimated TJ TJ=PD × RθJA+TA (6) In a quiescent state, PD is given by the product of the power supply and the quiescent current of the op amp. Equation 7 shows the calculation of TJ for the OPAx591 assuming an 85V power supply is used and an operating temperature of 25°C. TJ= 85V ×550μA ×165.4°CW+25°C (7) TJ=32.73°C (8) The low power consumption of the OPAx591 causes minimal self-heating even in a small SOT23-5 package as given by Equation 8. In a loaded condition, PD is equal to addition of the quiescent power, PDQ and the power dissipated by the output stage, PDL. The worst-case condition is given when the output voltage is equal to ½ of either supply rail (assuming symmetrical supplies, V+ and V-). In a worst-case condition, PDL is given by Equation 9. PDL= V+ 24×RL (9) For example, assume the OPAx591 is powered with bipolar ±42.5V power supplies and drives a 5kΩ load, RL, to ground. The maximum increase in TJ is expected to be about 22°C as given by Equation 10. In this example, to keep the op amp within the Absolute Maximum Ratings, operate in TA well under 128°C to account for different factors. ∆TJ= 46.75mW+90.3mW ×165.4°CW (10) For high-voltage amplifiers such as the OPAx591, the junction temperature can easily be tens of degrees higher than the ambient temperature in a quiescent (unloaded) condition. As shown by Equation 6, the junction temperature depends on the thermal properties of the package, as expressed by the junction-to-ambient thermal resistance (RϴJA). Temperature ( C) 90 95 100 105 110 115 120 125 130 135 140 145 150 0 10 20 30 40 50 Unloaded 10k 2k Figure 7-9. OPA591 (SOT23-5) Thermal Safe Operating Area Temperature ( C) 50 60 70 80 90 100 110 120 130 140 150 0 10 20 30 40 50 Unloaded 10k 2k Figure 7-10. OPA2591 (VSSOP-8) Thermal Safe Operating Area OPA591, OPA2591 SBOSA47A – FEBRUARY 2026 – REVISED SEPTEMBER 2026 www.ti.com 26 Submit Document Feedback Copyright © 2026 Texas Instruments Incorporated Product Folder Links: OPA591 OPA2591 |
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