SMARTCARD MCU

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Table 4. Ordering Information Scheme

Note: *where “y” indicates the sawing orientation as shown in Figure 2

Figure 2. Sawing orientation

Sawn wafers are scribed and mounted in a frame

on adhesive tape. The orientation is defined by the

position of the GND pad on the die, viewed with

active area of product visible, relative to the notch-

es of the frame (as shown in Figure 2). The orien-

tation of the die with respect to the plastic frame

notches is specified by the Customer.

One further concern, when specifying devices to

be delivered in this form, is that wafers mounted

on adhesive tape must be used within a limited pe-

riod from the mounting date:

– two months, if wafers are stored at 25°C, 55%

relative humidity

– six months, if wafers are stored at 4°C, 55% rel-

ative humidity

Example:

ST19SF08C

D45

XXX

Z

Product name

Pre-personalization name

“+” if no pre-personalization

Delivery Form

Customer ROM code name

Dxx: Module contact or dual

Cxx: Contactless modules

Oxx: SO package

Wxx: Unsawn wafer

Sxy*: Sawn wafer (std UV tape)

Rxy*: Sawn wafer (insolated UV tape) or SO on tape and reel

AI02171

1

ORIENTATION

GND

GND

GND

GND

23

4

VIEW: WAFER FRONT SIDE