Package mechanical data

STG4158

16/

6

Package mechanical data

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

Figure 14.

Flip-Chip6 package outline

1.

The terminal pin 1 on the bumps side is identified by a distinguishing feature (for instance by a circular

"clear area" - typically 0.1mm diameter). The terminal pin 1 on the backside of the product is identified by a

distinguishing feature (for instance by a circular "dot" - typically 0.5 mm diameter).

2.

Drawing not to scale.

Top view

E

12

3

A1 see note 1

A

B

e

f

E1

Bottom view

C

ccc C

b

7504896_J