STLS2E02

Package information

3/5

2

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 2.

PBGA452 mechanical data & package dimensions

OUTLINE AND

MECHANICAL DATA

DIM.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A

2.460

0.0969

A1

0.360

0.0142

A2

1.730

0.0681

b

0.600

0.750

0.900 0.0236 0.0295 0.0354

D

35.000

1.3780

D1

31.750

1.2500

D2

30.000

1.1811

E

35.000

1.3780

E1

31.750

1.2500

E2

30.000

1.1811

e

1.270

0.0500

F

1.630

0.0642

H

22.500

23.500 0.8858

0.9252

ddd

0.200

0.0079

eee

0.300

0.0118

fff

0.150

0.0059

HS/PBGA452 (35x35x2.33mm)

Slug Plastic Ball Grid Array

7656604 A