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STW5095T Datasheet(PDF) 71 Page - STMicroelectronics |
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STW5095T Datasheet(HTML) 71 Page - STMicroelectronics |
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71 / 73 page ![]() Package outline STw5095 70/72 19 Package outline Figure 33. Package mechanical data Note: 1 The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink or metallized markings, or other feature of package body or integral heatslug. A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1 corner. Exact shape of each corner is optional. Table 29. Package dimensions (mm) Ref. Min. Typ. Max. Outline and mechanical data A (1) 1. The total profile height is measured from the seating plane to the top of the component. 1.010 1.200 (2) 2. Max mounted height is 1.12mm.Based on a 0.28mm ball pad diameter. Solder paste is 0.15mm thickness and 0.28mm diameter. A1 0.150 A2 0.820 b 0.250 0.300 0.350 D 4.850 5.000 5.150 D1 3.500 E 4.850 5.000 5.150 E1 3.500 e 0.450 0.500 0.550 f 0.600 0.750 0.900 TFBGA 5x5x1.20 64 F8x8 0.50 Thin Profile Fine Pitch Ball Grid Array ddd 0.080 ddd C C A1 A A2 ef D1 D H G F E D C B A 12345678 A1 CORNER INDEX AREA Øb (64 BALLS) PLANE SEATING BOTTOM VIEW See Note 1 |
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