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TSA0801 Datasheet(PDF) 16 Page - STMicroelectronics |
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TSA0801 Datasheet(HTML) 16 Page - STMicroelectronics |
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16 / 20 page ![]() TSA0801 16/20 performances when configured as shown on Figure 8. Figure 8 : External reference setting At 15Msps sampling frequency, 1MHz input fre- quency and -1dBFS amplitude signal, perfor- mances can be improved of up to 2dBc on SFDR and 0.3dB on SINAD. At 40Msps sampling fre- quency, 1MHz input frequency and -1dBFS ampli- tude signal, performances can be improved of up to 1dBc on SFDR and 0.6dB on SINAD. This can be very helpful for example for multichan- nel application to keep a good matching among the sampling frequency range. Clock input The quality of your converter is very dependant on your clock input accuracy, in terms of aperture jit- ter; the use of low jitter crystal controlled oscillator is recommended. The duty cycle must be between 45% and 55%. The clock power supplies must be separated from the ADC output ones to avoid digital noise modu- lation at the output. It is recommended to always keep the circuit clocked, even at the lowest specified sampling frequency of 0.5Msps, before applying the supply voltages. Power consumption optimization The internal architecture of the TSA0801 enables to optimize the power consumption according to the sampling frequency of the application. For this purpose, a resistor is placed between IPOL and the analog Ground pins. The TSA0801 will combine highest performances and lowest consumption at 40Msps when Rpol is equal to 18k Ω. At lower sampling frequency range (< 10Msps), this value of resistor may be adjusted in order to decrease the analog current without any degradation of dynamic performances. As an example, 10mW total power consumption is achieved at 5 Msps with Rpol equel to 390k Ω. The table below sums up the relevant data. Total power consumption optimization depending on Rpol value Layout precautions To use the ADC circuits in the best manner at high frequencies, some precautions have to be taken for power supplies: - First of all, the implementation of 4 separate proper supplies and ground planes (analog, digi- tal, internal and external buffer ones) on the PCB is mandatory for high speed circuit applications to provide low inductance and low resistance com- mon return. The separation of the analog signal from the digi- tal part is essential to prevent noise from coupling onto the input signal. - Power supply bypass capacitors must be placed as close as possible to the IC pins in order to improve high frequency bypassing and reduce harmonic distortion. - Proper termination of all inputs and outputs must be incorporated with output termination resistors; then the amplifier load will be only resistive and the stability of the amplifier will be improved. All leads must be wide and as short as possible especially for the analog input in order to decrease parasitic capacitance and inductance. - To keep the capacitive loading as low as possible at digital outputs, short lead lengths of routing are essential to minimize currents when the output changes. To minimize this output capacitance, buffers or latches close to the output pins will relax this constraint. - Choose component sizes as small as possible (SMD). 1k Ω TSA0801 VIN VINB VREFM VREFP external reference TS821 VCCA 330pF 470nF 10nF Fs (Msps) 5 15 25 40 Rpol ( k Ω) 390 40 25 18 Optimized power (mW) 10 25 35 40 |
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