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SMD15 Datasheet(PDF) 2 Page - SeCoS Halbleitertechnologie GmbH

Part # SMD15
Description  300W TVS DIODE
PDF  2 Pages
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Manufacturer  SECOS [SeCoS Halbleitertechnologie GmbH]
Direct Link  http://www.secosgmbh.com
Logo SECOS - SeCoS Halbleitertechnologie GmbH

SMD15 Datasheet(HTML) 2 Page - SeCoS Halbleitertechnologie GmbH

  SMD15 Datasheet HTML 1Page - SeCoS Halbleitertechnologie GmbH SMD15 Datasheet HTML 2Page - SeCoS Halbleitertechnologie GmbH  
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Any changing of specification will not be informed individual
http://www.SeCoSGmbH.com
Elektronische Bauelemente
0. 01
0.1
1
10
0.1
1
10
100
1000
Pulse Duration - tp (us)
Non-Repetitive Peak Pulse Power vs. Pulse Time
SMD03 THRU SMD36
300W TVS DIODE
0
10
20
30
40
50
60
70
80
90
100
110
0
25
50
75
100
125
150
Ambient Temperature - TA (oC)
Power Derating Curve
0
10
20
30
40
50
60
70
80
90
100
110
0
5
10
15
20
25
30
Time (us)
e
-t
td = IPP /2
Wave form
Paramete rs:
tr = 8 s
td = 20 s
Pulse Waveform
Applications Information
Device Connection Options
The SM series is designed to protect one
unidirectional data or l/O lines operating at 5 to
36 volts.Connection options are as follows:
•
Unidirectional:Data lines are connected to pin1
and Pin 3 is connected to ground.For best
results,this pin should be connected directly to a
ground plane on the board.The path lengh should
be kept as short as possible to minimize parasitic
inductance.
Circuit Board Layout Recommendations for suppres-
sion of ESD.
Good circuit board layout is critical for the suppression
of fast rise-time transients such as ESD.The following
guidelines are recommended (Refer to application note
Sl99.01 for more detailed information):
•
Place the TVS near the input terminals or connec-
tors to restrict transient coupling.
•
Minimize the path length between the TVS and the
protected line.
•
Minimize all conductive loops including power and
ground loops.
•
The ESD transient return path toground should be
kept as short as possible.
•
Never run critical signals near board edges
•
Use ground planes whenever possib|e.
Number
1.4
4.0
mm
1.2
0.9
0.95
2.6
Suggested Solder Pad Layout
0.9
1.4
16-Oct.-2006 Rev. B
Page 2 of 2
16-Oct.-2008 Rev. D
Page 2 of 2



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