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LTM4615

4615f

APPLICATIONS INFORMATION

Safety Considerations

The LTM4615 modules do not provide isolation from VIN to

VOUT. There is no internal fuse. If required, a slow blow fuse

with a rating twice the maximum input current needs to be

provided to protect each unit from catastrophic failure.

Layout Checklist/Example

The high integration of LTM4615 makes the PCB board

layout very simple and easy. However, to optimize its electri-

cal and thermal performance, some layout considerations

are still necessary.

• Use large PCB copper areas for high current path,

including VIN, GND and VOUT. It helps to minimize the

PCB conduction loss and thermal stress.

• Place high frequency ceramic input and output capaci-

tors next to the VIN, GND and VOUT pins to minimize

high frequency noise.

• Place a dedicated power ground layer underneath the

unit.

• To minimize the via conduction loss and reduce module

thermal stress, use multiple vias for interconnection

between the top layer and other power layers.

• Do not put via directly on pads unless the via is

capped.

Figure 11 gives a good example of the recommended

layout.

CIN1

GND1 CONTROL

GND2

SW2

GND1

VIN1

GND1

SW1

CONTROL

LD0_IN

GND3

GND2

GND3

GND1

LDO_OUT

VOUT2

VOUT1

VIN2

GND2

4615 F11

VOUT1

3456789

10 11 12

CIN3

COUT4 COUT5

COUT1 COUT2

COUT3

CIN2

Figure 11. Recommended PCB Layout

LTM4615EVPBF Datasheet(PDF) 18 Page - Linear Technology

LTM4615EVPBF Datasheet(HTML) 18 Page - Linear Technology

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