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Visit www.macom.com for additional data sheets and product information.

M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or

information contained herein without notice.

V6

MA4SW410

ADVANCED: Data Sheets contain information regarding a product M/A-COM is considering for

development. Performance is based on target specifications, simulated results, and/or prototype

measurements. Commitment to develop is not guaranteed.

PRELIMINARY: Data Sheets contain information regarding a product M/A-COM has under develop-

ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has

been fixed. Engineering samples and/or test data may be available. Commitment to produce in

volume is not guaranteed.

HMIC™ Silicon SP4T PIN Diode Switch

RoHS Compliant

MA4SW410 Chip Dimensions

NOMINAL

A

.066

1.67

B

.047

1.19

C

.054

1.37

D

.012

0.31

E

.043

1.08

F

.009

0.22

G

.004

0.11

H

.004

0.11

I

.033

0.84

J

.061

1.56

Thickness

.005

.120

Bond

Pads

.005X.005

0.120X.0120

DIM

INCHES

MM

NOMINAL

NOMINAL

A

.066

1.67

B

.047

1.19

C

.054

1.37

D

.012

0.31

E

.043

1.08

F

.009

0.22

G

.004

0.11

H

.004

0.11

I

.033

0.84

J

.061

1.56

Thickness

.005

.120

Bond

Pads

.005X.005

0.120X.0120

Notes:

1.

Topside and backside metallization is gold,

2.5 µm thick

A

I

J

C

D

E

B

F

G

H

All tolerances are ± .0005 inches