MBRB20100CT

3

Rectifier Device Data

INFORMATION FOR USING THE D2PAK SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor packages must be

the correct size to insure proper solder connection interface

between the board and the package. With the correct pad

geometry, the packages will self align when subjected to a

solder reflow process.

mm

inches

0.74

18.79

0.065

1.651

0.07

1.78

0.14

3.56

0.330

8.38

0.420

10.66

D2PAK POWER DISSIPATION

The power dissipation of the D2PAK is a function of the drain

pad size. This can vary from the minimum pad size for

soldering to a pad size given for maximum power dissipation.

Power dissipation for a surface mount device is determined by

TJ(max), the maximum rated junction temperature of the die,

R

θJA, the thermal resistance from the device junction to

ambient; and the operating temperature, TA. Using the values

provided on the data sheet for the D2PAK package, PD can be

calculated as follows:

PD =

TJ(max) – TA

R

θJA

The values for the equation are found in the maximum

ratings table on the data sheet. Substituting these values into

the equation for an ambient temperature TA of 25°C, one can

calculate the power dissipation of the device which in this case

is 2.5 watts.

PD =

150

°C – 25°C

50

°C/W

= 2.5 watts

The 50

°C/W for the D2PAK package assumes the use of the

recommended footprint on a glass epoxy printed circuit board

to achieve a power dissipation of 2.5 watts. There are other

alternatives to achieving higher power dissipation from the

D2PAK package. One is to increase the area of the drain pad.

By increasing the area of the drain pad, the power dissipation

can be increased. Although one can almost double the power

dissipation with this method, one will be giving up area on the

printed circuit board which can defeat the purpose of using

surface mount technology.

Another alternative would be to use a ceramic substrate or

an aluminum core board such as Thermal Clad

™. Using a

board material such as Thermal Clad, an aluminum core

board, the power dissipation can be doubled using the same

footprint.