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MS3261R10ML Datasheet(PDF) 1 Page - ABC Taiwan Electronics Corp |
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MS3261R10ML Datasheet(HTML) 1 Page - ABC Taiwan Electronics Corp |
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1 / 6 page ![]() ABC'S ITEM NO. ABC'S DWG NO. SPECIFICATION FOR APPROVAL Temperatu re +4.0 / sec max. ℃ Rising Area Max time above 230℃ :5 0sec max. Max time above 200℃ :7 0sec max. Peak Temp:260℃ max. d﹒Remark:Products comply with RoHS' requirements AR-001A Type F ( kgf ) time ( sec ) b﹒Operating temp.:-55℃ ---- +125℃ a﹒Storage temp.:-40℃---- +105℃ Ⅳ﹒GENERAL SPECIFICATION: Solder temp. : 260±5℃ Flux : Rosin Dip time : 4±1 seconds Solder : Sn96.5 / Ag3 / Cu0.5 MS3261 1.0 d﹒Solderability: c﹒Terminal storength: 250 30±5 or equivalent 100 0 50 150 200 F NAME PROD. REF : b﹒Internal conductor:Silver or Ag / Pd Ⅱ﹒SCHEMATIC DIAGRAM: a﹒Body:Ferrite Ⅲ﹒MATERIALS: c﹒Terminal:Cu/Sn Series MS3261 A 3.20±0.20 B 1.60±0.20 C 1.10±0.20 B A D Ⅰ﹒CONFIGURATION & DIMENSIONS: MULTILAYER CHIP INDUCTOR D +2.0 ~ 4.0℃ / sec max. Reflow Area 70sec max. 100 50 Time ( seco nd s ) 150 Preheat Area 150 ~ 200 / 60 ~ 120sec ℃ 260℃ 200 250 50sec max. 230℃ -(1 .0 ~ 5.0) / sec max. ℃ P eak Temperature: Forced Coo ling Area I G I ( PCB Pattern ) a D 0.60±0.40 G 2.2 c b Unit : m/m I H 1.4 1.1 MS3261□□□□L□-□□□ PAGE: 1 |
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