ADL5801ACPZ-R7 datasheet(17/20 Pages) AD

17 / 20 page

ADL5801

Rev. 0 | Page 17 of 20

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-8

2.65

2.50 SQ

2.35

0.60 MAX

0.50

0.40

0.30

0.23

0.18

2.50 REF

0.50

BSC

12° MAX

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

1.00

0.85

0.80

SEATING

PLANE

PIN 1

INDICATOR

TOP

VIEW

3.75

BSC SQ

4.00

BSC SQ

PIN 1

INDICATOR

0.60 MAX

COPLANARITY

0.08

0.20 REF

0.23 MIN

EXPOSED

PA D

(BOTTOMVIEW)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 36. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

4 mm × 4 mm Body, Very Thin Quad (CP-24-3)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package

Option

Ordering

Quantity

ADL5801ACPZ-R7

−40°C to +85°C

24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-24-3

1,500 per Reel

ADL5801-EVALZ

Evaluation Board

Z = RoHS Complaint Part.

ADL5801ACPZ-R7 Datasheet(PDF) 17 Page - Analog Devices

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