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PCF8564ACX9/B/1 Datasheet(PDF) 25 Page - NXP Semiconductors

Part # PCF8564ACX9/B/1
Description  Real time clock and calendar
PDF  44 Pages
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

PCF8564ACX9/B/1 Datasheet(HTML) 25 Page - NXP Semiconductors

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PCF8564A_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 1 — 8 October 2009
25 of 44
NXP Semiconductors
PCF8564A
Real time clock and calendar
11. Internal circuitry
12. Limiting values
[1]
Pass level; Human Body Model (HBM) according to Ref. 6 “JESD22-A114”.
[2]
Pass level; Machine Model (MM), according to Ref. 7 “JESD22-A115”.
[3]
Pass level; latch-up testing, according to Ref. 8 “JESD78” at maximum ambient temperature
(Tamb(max) = +85 °C).
[4]
According to the NXP store and transport conditions (see Ref. 10 “SNW-SQ-623”) the devices have to be
stored at a temperature of +5
°C to +45 °C and a humidity of 25 % to 75 %.
Fig 20. Device diode protection diagram
013aaa035
SDA
SCL
VDD
CLKOE
OSCI
OSCO
VSS
PCF8564A
INT
CLKOUT
Table 28.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
Unit
VDD
supply voltage
−0.5
+6.5
V
VI
input voltage
−0.5
+6.5
V
VO
output voltage
−0.5
+6.5
V
IDD
supply current
−50.0
+50.0
mA
II
input current
−10.0
+10.0
mA
IO
output current
−10.0
+10.0
mA
ISS
ground supply current
−50.0
+50.0
mA
Ptot
total power dissipation
-
300
mW
Tamb
ambient temperature
−40.0
+85
°C
VESD
electrostatic discharge voltage
HBM
[1]
die type 1 and 3
-
±2500
V
die type 2
-
±3500
V
MM
[2]
die type 1 and 3
-
±200
V
die type 2
-
±250
V
Ilu
latch-up current
all pins but OSCI
[3] -
100
mA
Tstg
storage temperature
[4]
−65.0
+150
°C



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