ZXM64P03X

146

THERMAL RESISTANCE

PARAMETER

SYMBOL

VALUE

UNIT

Junction to Ambient (a)

113

°C/W

Junction to Ambient (b)

70

°C/W

NOTES

(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper,

in still air conditions

(b) For a device surface mounted on FR4 PCB measured at t 10 secs.

(c) Repetitive rating - pulse width limited by maximum junction temperature. Refer to Transient Thermal

Impedance graph.

ABSOLUTE MAXIMUM RATINGS.

PARAMETER

SYMBOL

LIMIT

UNIT

Drain-Source Voltage

-30

V

Gate- Source Voltage

± 20

V

-3.8

-3.0

A

Pulsed Drain Current (c)

-19

A

Continuous Source Current (Body Diode)(b)

-2.3

A

Pulsed Source Current (Body Diode)(c)

-19

A

Linear Derating Factor

1.1

8.8

W

mW/°C

Linear Derating Factor

1.8

14.4

W

mW/°C

Operating and Storage Temperature Range

-55 to +150

°C

PROVISIONAL ISSUE A - JULY 1999