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MPC8572ECLPXATLD Datasheet(PDF) 122 Page - Freescale Semiconductor, Inc |
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MPC8572ECLPXATLD Datasheet(HTML) 122 Page - Freescale Semiconductor, Inc |
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122 / 140 page ![]() MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 4 122 Freescale Semiconductor Thermal 19.5.2 Minimum Platform Frequency Requirements for High-Speed Interfaces Section 4.4.3.6 “I/O Port Selection” of the MPC8572E PowerQUICC™ III Integrated Host Processor Family Reference Manual, describes various high-speed interface configuration options. Note that the CCB clock frequency must be considered for proper operation of such interfaces as described below. For proper PCI Express operation, the CCB clock frequency must be greater than or equal to: See Section 21.1.3.2, “Link Width” of the MPC8572E PowerQUICC™ III Integrated Host Processor Family Reference Manual, for PCI Express interface width details. Note that the “PCI Express link width” in the above equation refers to the negotiated link width as the result of PCI Express link training, which may or may not be the same as the link width POR selection. For proper serial RapidIO operation, the CCB clock frequency must be greater than: See Section 20.4, “1x/4x LP-Serial Signal Descriptions” of the MPC8572E PowerQUICC™ III Integrated Host Processor Family Reference Manual, for serial RapidIO interface width and frequency details. 20 Thermal This section describes the preliminary thermal specifications of the MPC8572E. This is subject to change. Table 83 shows the thermal characteristics for the package, 1023 33x33 FC-PBGA. The package uses a 29.6 x 29.6 mm lid that attaches to the substrate. Recommended maximum heat sink force is 10 pounds force (45 Newton). Table 83. Package Thermal Characteristics Rating Board Symbol Value Unit Notes Junction to ambient, natural convection Single-layer (1s) RΘJA 15 °C/W 1, 2 Junction to ambient, natural convection Four-layer (2s2p) RΘJA 11 °C/W 1, 3 Junction to ambient (at 200 ft./min.) Single-layer (1s) RΘJMA 11 °C/W 1, 3 Junction to ambient (ar 200 ft./min.) Four-layer (2s2p) RΘJMA 8 °C/W 1, 3 Junction to board — RΘJB 4 °C/W 4 527 MHz PCI Express link width () × 8 ---------------------------------------------------------------------------------------------- 20.80 () serial RapidIO interface frequency () × × serial RapidIO link width () × 64 ----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- |
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