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MSC8252 Datasheet(PDF) 1 Page - Freescale Semiconductor, Inc |
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MSC8252 Datasheet(HTML) 1 Page - Freescale Semiconductor, Inc |
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1 / 68 page  Freescale Semiconductor Data Sheet: Product Preview Document Number: MSC8252 Rev. 3, 12/2010 © 2008, 2010 Freescale Semiconductor, Inc. This document contains information on a product under development. Freescale reserves the right to change or discontinue this product without notice. MSC8252 FC-PBGA–783 29 mm × 29 mm •Two StarCore SC3850 DSP subsystems, each with an SC3850 DSP core, 32 Kbyte L1 instruction cache, 32 Kbyte L1 data cache, unified 512 Kbyte L2 cache configurable as M2 memory in 64 Kbyte increments, memory management unit (MMU), extended programmable interrupt controller (EPIC), two general-purpose 32-bit timers, debug and profiling support, low-power Wait, Stop, and power-down processing modes, and ECC/EDC support. • Chip-level arbitration and switching system (CLASS) that provides full fabric non-blocking arbitration between the cores and other initiators and the M2 memory, shared M3 memory, DDR SRAM controllers, device configuration control and status registers, and other targets. • 1056 Kbyte 128-bit wide M3 memory, 1024 Kbytes of which can be turned off to save power. • 96 Kbyte boot ROM. • Three input clocks (one global and two differential). • Five PLLs (three global and two Serial RapidIO PLLs). • Two DDR controllers with up to a 400 MHz clock (800 MHz data rate), 64/32 bit data bus, supporting up to a total 2 Gbyte in up to four banks (two per controller) and support for DDR2 and DDR3. • DMA controller with 32 unidirectional channels supporting 16 memory-to-memory channels with up to 1024 buffer descriptors per channel, and programmable priority, buffer, and multiplexing configuration. It is optimized for DDR SDRAM. • Up to four independent TDM modules with programmable word size (2, 4, 8, or 16-bit), hardware-base A-law/ μ-law conversion, up to 62.5 Mbps data rate for each TDM link, and with glueless interface to E1 or T1 framers that can interface with H-MVIP/H.110 devices, TSI, and codecs such as AC-97. • High-speed serial interface that supports two Serial RapidIO interfaces, one PCI Express interface, and two SGMII interfaces (multiplexed). The Serial RapidIO interfaces support 1x/4x operation up to 3.125 Gbaud with a single messaging unit and two DMA units. The PCI Express controller supports 32- and 64-bit addressing, x4, x2, and x1 link. • QUICC Engine technology subsystem with dual RISC processors, 48 Kbyte multi-master RAM, 48 Kbyte instruction RAM, supporting two communication controllers for two Gigabit Ethernet interfaces (RGMII or SGMII), to offload scheduling tasks from the DSP cores, and an SPI. • I/O Interrupt Concentrator consolidates all chip maskable interrupt and non-maskable interrupt sources and routes then to INT_OUT, NMI_OUT, and the cores. • UART that permits full-duplex operation with a bit rate of up to 6.25 Mbps. • Two general-purpose 32-bit timers for RTOS support per SC3850 core, four timer modules with four 16-bit fully programmable timers, and eight software watchdog timers (SWT). • Eight programmable hardware semaphores. • Up to 32 virtual interrupts and a virtual NMI asserted by simple write access. •I2C interface. • Up to 32 GPIO ports, sixteen of which can be configured as external interrupts. • Boot interface options include Ethernet, Serial RapidIO interface, I2C, and SPI. • Supports standard JTAG interface • Low power CMOS design, with low-power standby and power-down modes, and optimized power-management circuitry. • 45 nm SOI CMOS technology. Dual-Core Digital Signal Processor |
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