Characteristics

STPS120MF

4/7

Figure 11.

Thermal resistance junction to ambient versus copper surface under tab

(epoxy printed board FR4, Cu = 35 µm, typical values)

Figure 7.

Reverse leakage current versus

reverse voltage applied (typical

values)

Figure 8.

Junction capacitance versus

reverse voltage applied (typical

values)

I (mA)

R

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

0

2

4

6

8

1012

1416

1820

T

T

T

T

T

T

V (V)

R

C(pF)

10

100

1000

0

2

4

6

8

10

12

14

16

18

20

F=1MHz

V

T

V (V)

R

Figure 9.

Forward voltage drop versus

forward current (low level)

Figure 10.

Forward voltage drop versus

forward current (high level)

I

(A)

FM

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

0.0

0.1

0.2

0.3

0.4

0.5

0.6

Tj=25°C

(Maximum values)

Tj=100°C

(Maximum values)

Tj=100°C

(Maximum values)

Tj=100°C

(Typical values)

Tj=100°C

(Typical values)

V

(V)

FM

I

(A)

FM

0.1

1.0

10.0

100.0

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

Tj=25°C

(Maximum values)

Tj=100°C

(Maximum values)

Tj=100°C

(Maximum values)

Tj=100°C

(Typical values)

Tj=100°C

(Typical values)

V

(V)

FM

R

(°C/W)

th(j-a)

0

25

50

75

100

125

150

175

200

225

250

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

S(cm²)