Heat Removal

With adequate airflow, no external heat sinking is need-

ed under most operating conditions. If excess heat must

be dissipated through the exposed pad, solder it to cir-

cuit board copper. The exposed pad must be either left

unconnected, isolated, or connected to ground.

Power Minimization

To minimize power consumption, activate only the

needed channels. Each channel placed in low-leakage

mode saves approximately 240mW.

Chip Information

PROCESS: BiCMOS

Quad, Ultra-Low-Power, 300Mbps ATE

Drivers/Comparators

20

______________________________________________________________________________________

SCLK

CS

DIN

D0

D1

D2

D3

D4

D5

D10

D11

D0 LAST

DOUT

LOAD

D1 LAST

D2 LAST

D3 LAST

D4 LAST

D5 LAST

D10 LAST

D11 LAST

D0

Figure 5. Serial-Interface Timing

Package Information

For the latest package outline information and land patterns

(footprints), go to www.maxim-ic.com/packages. Note that a

“+”, “#”, or “-” in the package code indicates RoHS status only.

Package drawings may show a different suffix character, but

the drawing pertains to the package regardless of RoHS status.

PACKAGE

TYPE

PACKAGE

CODE

OUTLINE

NO.

LAND

PATTERN NO.

80 TQFP-EP

C80E+4

21-0115

90-0152