PCF8564A_10 datasheet(37/45 Pages) NXP

37 / 45 page

PCF8564A

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Product data sheet

Rev. 02 — 30 September 2010

37 of 45

NXP Semiconductors

PCF8564A

Real time clock and calendar

18.2 Tape and reel information

[1]

Die is placed in pocket bump side down.

19. Soldering of WLCSP packages

19.1 Introduction to soldering WLCSP packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note

AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface

mount reflow soldering description”.

Wave soldering is not suitable for this package.

Fig 33. Tape and reel details for PCF8564ACX9/B/1

Table 35.

Tape and reel dimensions [1]

Dimension

Description

Value

tape width

8 mm

pocket length

1.5 mm

pocket width

2.2 mm

pocket depth

0.25 mm

pocket pitch

4 mm

Transparent top view. The orientation of the IC in a pocket is indicated by the position of pin 1, with

respect to the sprocket holes.

Fig 34. Pin 1 indication for PCF8564ACX9/B/1

4 mm

direction of feed

013aaa202

013aaa191

pin 1

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