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ADP2370ACPZ-3.0-R7 Datasheet(PDF) 7 Page - Analog Devices

Part # ADP2370ACPZ-3.0-R7
Description  High Voltage, 1.2 MHz/600 kHz, 800 mA
PDF  32 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADP2370ACPZ-3.0-R7 Datasheet(HTML) 7 Page - Analog Devices

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Data Sheet
ADP2370/ADP2371
Rev. A | Page 7 of 32
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
ADP2370/ADP2371
TOP VIEW
(Not to
Scale)
3
EN
4
SYNC
1
VIN
NOTES
1. THE EXPOSED PAD ON THE BOTTOM OF THE PACKAGE ENHANCES
THE THERMAL PERFORMANCE AND IS ELECTRICALLY CONNECTED
TO GROUND INSIDE THE PACKAGE. THE EXPOSED PAD MUST BE
CONNECTED TO THE GROUND PLANE ON THE CIRCUIT BOARD
FOR PROPER OPERATION.
2
FSEL
6 PG
5 FB
8 PGND
7 SW
Figure 2. Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
Mnemonic
Description
1
VIN
Power Input.
2
FSEL
Frequency Select. High = 1.2 MHz, low = 600 kHz.
3
EN
Enable. Enable input with precision thresholds.
4
SYNC
Synchronize. This pin is used to synchronize the device to an external 600 kHz to 1.2 MHz clock or forces
PWM mode when it is held high. SYNC held low forces automatic PWM/PSM operation.
5
FB
Feedback. This pin provides feedback from the output.
6
PG
Power Good. PG is an open-drain output.
7
SW
Switch. This pin serves as the connection from the power MOSFETs to the inductor.
8
PGND
Power Ground.
EPAD
Exposed Pad. The exposed pad on the bottom of the package enhances the thermal performance and is
electrically connected to ground inside the package. The exposed pad must be connected to the ground
plane on the circuit board for proper operation.



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