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CXG1053FN Datasheet(PDF) 8 Page - Sony Corporation |
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CXG1053FN Datasheet(HTML) 8 Page - Sony Corporation |
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8 / 8 page  – 8 – CXG1053FN Package Outline Unit: mm SONY CODE EIAJ CODE JEDEC CODE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY PACKAGE STRUCTURE 0.06g HSOF-26P-01 HSOF 26PIN(PLASTIC) B 0.4 0.07 M *5.6 ± 0.05 1 13 14 26 A S A S 0.9 ± 0.1 0.08 S 0.2 4.4 0.2 4.2 5.5 NOTE: Dimension “ ∗” does not include mold protrusion. 0.14 – 0.03 DETAILB 0.2 ± 0.05 Solder Plating + 0.05 |
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