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OP90AZ/883 Datasheet(PDF) 5 Page - Analog Devices |
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OP90AZ/883 Datasheet(HTML) 5 Page - Analog Devices |
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5 / 12 page ![]() REV. A OP90 –5– ORDERING GUIDE Package Options TA = 25 C Operating VOS Max CERDIP Plastic Temperature (mV) 8-Lead 8-Lead Range 150 OP90AZ/883 * MIL 150 OP90EZ * IND 450 OP90GP XIND 450 OP90GS XIND *Not for new design, obsolete April 2002. ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V Differential Input Voltage . . . . [(V–) – 20 V] to [(V+) + 20 V] Common-Mode Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . [(V–) – 20 V] to [(V+) + 20 V] Output Short-Circuit Duration . . . . . . . . . . . . . . . . Indefinite Storage Temperature Range Z Package . . . . . . . . . . . . . . . . . . . . . . . . . –65 °C to +150°C P Package . . . . . . . . . . . . . . . . . . . . . . . . . –65 °C to +150°C Operating Temperature Range OP90A . . . . . . . . . . . . . . . . . . . . . . . . . . . –55 °C to +125°C OP90E . . . . . . . . . . . . . . . . . . . . . . . . . . . . –25 °C to +85°C OP90G . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40 °C to +85°C Junction Temperature (TJ) . . . . . . . . . . . . . –65 °C to +150°C Lead Temperature (Soldering 60 sec) . . . . . . . . . . . . . . 300 °C CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the OP90 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE Package Type JA 2 JC Unit 8-Lead Hermetic DIP (Z) 148 16 °C/W 8-Lead Plastic DIP (P) 103 43 °C/W 8-Lead SO (S) 158 43 °C/W NOTES 1Absolute Maximum Ratings apply to packaged parts, unless otherwise noted. 2 JA is specified for worst-case mounting conditions; i.e., JA is specified for device in socket for CerDIP, and P-DIP; JA is specified for devices soldered to printed circuit board for SO package. |
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