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ACT31 Datasheet(PDF) 1 Page - Advanced Crystal Technology

Part # ACT31
Description  a compact crystal resonator
PDF  2 Pages
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Manufacturer  ACT [Advanced Crystal Technology]
Direct Link  http://www.actcrystals.com
Logo ACT - Advanced Crystal Technology

ACT31 Datasheet(HTML) 1 Page - Advanced Crystal Technology

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Tel: 0044 (0)118 979 1238
Fax: 0044 (0)118 979 1283
E-mail: info@actcrystals.com
DC100V±15V
In line with our ongoing policy of product evolvement and improvement, the above specification may be subject to change without notice.
ISO9001: 2000 Registered
For quotations or further information please contact us at:
3 The Business Centre, Molly Millars Lane, Wokingham, Berks, RG41 2EY, UK
http://www.actcrystals.com
120
 max
100
 max
80
 max
Please specify
fo 9~10MHz
fo 4.0~4.999MHz
fo 5~5.999MHz
fo 6~6.999MHz
fo 7~8.999MHz
60
 max
ACT31
Specification
Specification
Symbol
Parameter
The ACT31 is a compact crystal resonator offering high vibration and shock resistance
together with high stability. It is most suitable for portable equipment and close packing
density. The device is offered with frequencies between 3.5 and 4.0MHz.
Frequency
Frequency Tolerance @25°C
Frequency Stability
3.579545-10MHz
±10~50ppm (TYP ±30ppm)
±10~50ppm (TYP ±30ppm)
fo
f/fo
f/fo
Temp Operating Range
Temp Storage Range
Equivalent Series Resistance
Shunt Capacitance
Load Capacitance
Drive Level
Insulation Resistance
Aging
Topr
Tstg
ESR
C0
-40 ~ +85°C
Fa
±5ppm max
CL
10~100
 W ( 30W typ)
200
 max
5.0pF typical
150
 max
DL
IR
Please note that all parameters can not necessarily be specified in the same device
Customer to Specify : Frequency, Frequency Tolerance, Operating Temperature Range & Load Capacitance
Condition
Please specify
fo 3.579545~3.999MHz
Please specify
500M
 Min
16.0pF (Others available.)
@ 25°C ±3°C 1
st year
-10 ~ +70°C
Issue : 4 C1b
Date : 31-5-2012
SOLDERING of CYLINDER CRYSTALS
Lead wire should be soldered within 5 seconds with the iron having a tip temperature of less than 270°C. Case
must not exceed 150°C
With regard to wave soldering it is recommended that the process is carried out with the crystal unit set upright on
the circuit board. Should the process be carried out with the crystal unit on its side then steps must be taken to
prevent heat transfer through the can.
Should the whole crystal unit be heated (in a re-flow oven for example) it will result in amarked deterioration of the
performance or even failure to oscillate. This is due to the internal construction of the crystal unit which involves
the use of solder.
Lead Surface
Material
+Cu, +Sn


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