TCM809/TCM810

DS21661E-page 8

 2001-2012 Microchip Technology Inc.

3-Lead Plastic Small Outline Transistor (NB) (SOT-23)

10

5

0

10

5

0



Mold Draft Angle Bottom

10

5

0

10

5

0



Mold Draft Angle Top

0.51

0.44

0.37

.020

.017

.015

B

Lead Width

0.18

0.14

0.09

.007

.006

.004

c

Lead Thickness

10

5

0

10

5

0



Foot Angle

0.55

0.45

0.35

.022

.018

.014

L

Foot Length

3.04

2.92

2.80

.120

.115

.110

D

Overall Length

1.40

1.30

1.20

.055

.051

.047

E1

Molded Package Width

2.64

2.37

2.10

.104

.093

.083

E

Overall Width

0.10

0.06

0.01

.004

.002

.000

A1

Standoff

§

1.02

0.95

0.88

.040

.037

.035

A2

Molded Package Thickness

1.12

1.01

0.89

.044

.040

.035

A

Overall Height

1.92

.076

p1

Outside lead pitch (basic)

0.96

.038

p

Pitch

3

3

n

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

2

1

p

D

B

n

E

E1

L

c







A2

A

A1

p1

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed

.010” (0.254mm) per side.

JEDEC Equivalent: TO-236

Drawing No. C04-104

§ Significant Characteristic

Note:

For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging