AD9765AST datasheet(8/44 Pages) AD

8 / 44 page

AD9763/AD9765/AD9767

Data Sheet

Rev. G | Page 8 of 44

ABSOLUTE MAXIMUM RATINGS

THERMAL RESISTANCE

Table 4.

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Parameter

With

Respect To

Rating

AVDD

ACOM

−0.3 V to +6.5 V

DVDD1, DVDD2

DCOM1/DCOM2

−0.3 V to +6.5 V

ACOM

DCOM1/DCOM2

−0.3 V to +0.3 V

AVDD

DVDD1/DVDD2

−6.5 V to +6.5 V

MODE,

CLK1/IQCLK,

CLK2/IQRESET,

WRT1/IQWRT,

WRT2/IQSEL

DCOM1/DCOM2

−0.3 V to DVDD1/

DVDD2 + 0.3 V

Digital Inputs

DCOM1/DCOM2

−0.3 V to DVDD1/

DVDD2 + 0.3 V

IOUTA1/IOUTA2,

IOUTB1/IOUTB2

ACOM

−1.0 V to AVDD + 0.3 V

REFIO, FSADJ1,

FSADJ2

ACOM

−0.3 V to AVDD + 0.3 V

GAINCTRL, SLEEP

ACOM

−0.3 V to AVDD + 0.3 V

Junction

Temperature

150°C

Storage

Temperature

Range

−65°C to +150°C

Lead Temperature

(10 sec)

300°C

Table 5. Thermal Resistance

Package Type

θJA

Unit

48-Lead LQFP

°C/W

ESD CAUTION

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

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