MAX258_13 datasheet(2/12 Pages) MAXIM

2 / 12 page

(All voltages referenced to GND.)

VDD, HICLK, EN......................................................-0.3V to +6V

T1, T2 .................................................................-0.3V to +16.5V

T1, T2 Maximum Continuous Current..............................+1.75A

Continuous Power Dissipation (TA = +70ºC)

TDFN (Multilayer Board)

(derate 16.7mW/ºC above +70ºC)..........................1333.3mW

Operating Temperature Range..........................-40ºC to +125ºC

Junction Temperature......................................................+150ºC

Storage Temperature Range.............................-65ºC to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Soldering Temperature (reflow).......................................+260°C

TDFN (Multilayer)

Junction-to-AmbientThermalResistance(θJA) ..........60°C/W

Junction-to-CaseThermalResistance(θJC)...............11°C/W

(Note 1)

(VDD = +3.0V to 5.5V, TA = TMIN to TMAX, unless otherwise noted. Typical values at VDD = +5.0V and TA = +25ºC.) (Note 2)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

DC CHARACTERISTICS

Supply Voltage Range

VDD

3.0

5.5

Supply Current

IDD

VEN = 0V, T1 and T2 not

connected

VHICLK = 0V

1.1

1.8

VHICLK = VDD

2.1

3.5

Disable Supply Current

IDIS

VEN = VDD, T1, T2, HICLK connected to GND

or VDD (Note 3)

µA

Driver Output Resistance

IOUT = 500mA

VDD = 3.0V

160

350

mΩ

VDD = 4.5V

145

300

Undervoltage Lockout

Threshold

VUVLO

VDD rising

2.6

2.75

2.9

Undervoltage Lockout

Threshold Hysteresis

VUVLO_HYST

250

T1, T2 Leakage Current

ILKG

VEN = VDD, T1, T2 = 0V or VDD

-1

µA

LOGIC SIGNALS (EN, HICLK)

Input Logic-High Voltage

VIH

Input Logic-Low Voltage

VIL

0.8

Input Leakage Current

IIL

EN, HICLK = 0V or 5.5V

-1

µA

MAX258

500mA, Push-Pull Transformer Driver

for Isolated Power Supplies

www.maximintegrated.com

Maxim Integrated │ 2

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to

www.maximintegrated.com/thermal-tutorial.

Absolute Maximum Ratings

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these

or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect

device reliability.

Package Thermal Characteristics

Electrical Characteristics

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