34

Film Chip Capacitors

PEN DIELECTRIC – CB Series

MOUNTING AND SOLDERING RECOMMENDATIONS

RECOMMENDED SOLDER PASTE THICKNESS

For optimum solderability, the recommended soldering

paste thickness: 1206 to 2824 :150 to 200μm

In case of hand soldering, the temperature of the soldering

iron should not be above 250°C. Special care must be taken

to avoid touching the capacitor body with the iron tip.

RECOMMENDED CLEANING

To clean flux from the PC board assembly, the recommended

products are: ethanol, isopropyl alcohol, and deionized water

wash. The cleaning products to avoid are: Toluene, Xylene,

Trichloroethylene, Terpene Cleaner EC-7, surface active

agent. In case of using another solvent, please contact us.

OTHER CAUTIONS

Flame retardancy: the dielectric film is not a flame retardant

material.

Environment: contact us when chips are used in humid or

gas atmosphere and /or when using resin.

Recommended handling: do not use edged tools, so not

to damage the capacitors.

TIN WHISKERS TESTS : JEDEC STANDARD NO 22A121

Stress Type

Ref. Spec.

Test Conditions

Analysis

Results

Temperature cycling

JESD22-A104

-55°C +85(+10/-0)°C air

SEM x 1000

Pass

5 to 10 minutes soak 3 cycles/hour

Ambient Temperature /

30+/-2°C - 60+/-3% RH -2000H

SEM x 1000

Pass

Humidity Storage

High Temperature /

70+/-5°C - 93+3/-2% RH -1000H

SEM x 1000

Pass

Humidity Storage

Size Code

Case Size

A

B

C

01

1206

1.30 (0.051)

1.30 (0.051)

2.20 (0.087)

02

1210

2.00 (0.079)

1.30 (0.051)

2.20 (0.087)

03

1812

3.00 (0.118)

1.50 (0.059)

3.50 (0.137)

04

2220

5.00 (0.195)

1.90 (0.075)

4.50 (0.178)

05

2824

6.00 (0.234)

2.50 (0.098)

5.70 (0.224)

16

4030

7.50 (0.295)

3.00 (0.118)

8.00 (0.315)

17

5040

11.2 (0.441)

3.50 (0.137)

10.3 (0.406)

18

6054

14.6 (0.575)

3.60 (0.147)

12.6 (0.496)

A

CB

*Reflow soldering referring to JEDEC Standard with some limitations

*JEDEC J-Std 020C

SOLDERING PROFILE

The capacitors can be mounted using infrared and vapor phase soldering following recommended below.

They are NOT suitable for wave soldering.

All temperature refer to topside of the package, measured on the package body surface.

Profile Feature

1206 to 1812

2220 to 6054

3°C / second max

3°C / second max

Preheat

150°C

150°C

200°C

200°C

180 sec. max

180 sec. max

Time maintained above

217°C

217°C

60 sec. max

75 sec. max

250°C

255°C

Time within 5°C of peak

10 sec.

10 sec.

Ramp-Down

6°C / sec.

6°C / sec.

030

Time (seconds)

60

90

120 150 180 210 240

Ramp

down

Ramp up

270 300 330