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ADP1754ACPZ-2.5-R7 Datasheet(PDF) 17 Page - Analog Devices |
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ADP1754ACPZ-2.5-R7 Datasheet(HTML) 17 Page - Analog Devices |
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17 / 20 page ![]() Data Sheet ADP1754/ADP1755 Rev. E | Page 17 of 20 Figure 42 through Figure 45 show junction temperature calcula- tions for different board temperatures, load currents, VIN to VOUT differentials, and areas of PCB copper. 140 120 100 80 60 40 20 0 0.25 0.75 1.25 1.75 2.25 2.75 VIN – VOUT (V) MAX JUNCTION TEMPERATURE LOAD = 10mA LOAD = 100mA LOAD = 200mA LOAD = 400mA LOAD = 800mA LOAD = 1.2A Figure 42. 500 mm2 of PCB Copper, TB = 25°C, LFCSP 140 120 100 80 60 40 20 0 0.25 0.75 1.25 1.75 2.25 2.75 VIN – VOUT (V) MAX JUNCTION TEMPERATURE LOAD = 10mA LOAD = 100mA LOAD = 200mA LOAD = 400mA LOAD = 800mA LOAD = 1.2A Figure 43. 500 mm2 of PCB Copper, TB = 50°C, LFCSP 140 120 100 80 60 40 20 0 0.25 0.75 1.25 1.75 2.25 2.75 VIN – VOUT (V) MAX JUNCTION TEMPERATURE LOAD = 10mA LOAD = 200mA LOAD = 400mA LOAD = 800mA LOAD = 1.2A LOAD = 100mA Figure 44. 1000 mm2 of PCB Copper, TB = 25°C, LFCSP 140 120 100 80 60 40 20 0 0.25 0.75 1.25 1.75 2.25 2.75 VIN – VOUT (V) MAX JUNCTION TEMPERATURE LOAD = 10mA LOAD = 200mA LOAD = 400mA LOAD = 800mA LOAD = 1.2A LOAD = 100mA Figure 45. 1000 mm2 of PCB Copper, TB = 50°C, LFCSP |
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