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L4979D Datasheet(PDF) 14 Page - STMicroelectronics |
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L4979D Datasheet(HTML) 14 Page - STMicroelectronics |
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14 / 22 page  Package and PCB thermal data L4979D, L4979MD 14/22 Doc ID 10262 Rev 9 4.2 SO-20 thermal data Figure 9. SO-20 PC board 1. Layout condition of Rth and Zth measurements (PCB: FR4 area = 58 mm x 58 mm, PCB thickness = 2 mm, Cu thickness = 35 mm, Copper areas: from minimum pad lay-out to 6cm2). Table 11. SO-8 thermal parameter Area (cm2)Footprint 2 R1 (°C/W) 4 R2 (°C/W) 2 R3 (°C/W) 2 R4 (°C/W) 41 R5 (°C/W) 40 R6 (°C/W) 58 40 C1 (W.s/°C) 0.0003 C2 (W.s/°C) 0.0025 C3 (W.s/°C) 0.03 C4 (W.s/°C) 0.04 C5 (W.s/°C) 0.1 C6 (W.s/°C) 1.05 2 |
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