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MP2115 Datasheet(PDF) 2 Page - Monolithic Power Systems |
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MP2115 Datasheet(HTML) 2 Page - Monolithic Power Systems |
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2 / 11 page ![]() MP2115 – 2A, 6V SYNCHRONOUS STEP-DOWN CONVERTER MP2115 Rev. 1.0 www.MonolithicPower.com 2 2/28/2011 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited. © 2011 MPS. All Rights Reserved. ORDERING INFORMATION Part Number* Package Top Marking Free Air Temperature (TA) MP2115DQ QFN10 (3mm x 3mm) 2X -40 °C to +85°C * For Tape & Reel, add suffix –Z (e.g. MP2115DQ–Z). For RoHS compliant packaging, add suffix –LF (e.g. MP2115DQ–LF–Z) PACKAGE REFERENCE TOP VIEW 1 2 3 4 5 10 9 8 7 6 EXPOSED PAD ON BACKSIDE CONNECT TO GND VIN ILIM FB GND FREQ PGND SW VSYS EN PG ABSOLUTE MAXIMUM RATINGS (1) VIN to GND ...................................-0.3V to +6.5V VSW to GND............................-0.3V to VIN +0.3V VFB, VEN, PG, VSYS, ILIM to GND ...............................................-0.3V to +6.5V Continuous Power Dissipation (TA = +25°C) (2) ............................................................. 2.5W Junction Temperature............................ +150 °C Lead Temperature ................................. +260 °C Storage Temperature .............. -65 °C to +150°C Recommended Operating Conditions (3) Supply Voltage VIN .............................2.8V to 6V Output Voltage VOUT...........................0.6V to 6V Maximum Junction Temp. (TJ) ............... +125°C Thermal Resistance (4) θJA θJC QFN10 (3x3)........................... 50 ...... 12... °C/W Notes: 1) Exceeding these ratings may damage the device. 2) The maximum allowable power dissipation is a function of the maximum junction temperature TJ (MAX), the junction-to- ambient thermal resistance θJA, and the ambient temperature TA. The maximum allowable continuous power dissipation at any ambient temperature is calculated by PD (MAX) = (TJ (MAX)-TA)/θJA. Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown. Internal thermal shutdown circuitry protects the device from permanent damage. 3) The device is not guaranteed to function outside of its operating conditions. 4) Measured on JESD51-7, 4-layer PCB. |
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