SPC5644AF0MLU2 datasheet(67/138 Pages) FREESCALE

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MPC5644A Microcontroller Data Sheet, Rev. 7

Freescale Semiconductor

3.3

Thermal characteristics

6 All functional non-supply I/O pins are clamped to VSS and VDDE, or VDDEH.

7 AC signal overshoot and undershoot of up to 2.0 V of the input voltages is permitted for an accumulative

duration of 60 hours over the complete lifetime of the device (injection current not limited for this duration).

8 Internal structures hold the voltage greater than –1.0 V if the injection current limit of 2 mA is met.

9 Internal structures hold the input voltage less than the maximum voltage on all pads powered by VDDEH

supplies, if the maximum injection current specification is met (2 mA for all pins) and VDDEH is within the

operating voltage specifications.

10 Internal structures hold the input voltage less than the maximum voltage on all pads powered by VDDE supplies,

if the maximum injection current specification is met (2 mA for all pins) and VDDE is within the operating voltage

specifications.

11 Total injection current for all pins (including both digital and analog) must not exceed 25 mA.

12 Total injection current for all analog input pins must not exceed 15 mA.

13 Solder profile per IPC/JEDEC J-STD-020D.

14 Moisture sensitivity per JEDEC test method A112.

Table 9. Thermal characteristics for 176-pin QFP1

1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.

Symbol

Parameter

Conditions

Value

Unit

RJA

D Junction-to-Ambient, Natural Convection2

2 Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board

meets JEDEC specification for this package.

Single layer board - 1s

°C/W

RJA

D Junction-to-Ambient, Natural Convection2

Four layer board - 2s2p

°C/W

RJMA

D Junction-to-Moving-Air, Ambient2

200 ft./min., single layer

board - 1s

°C/W

RJMA

D Junction-to-Moving-Air, Ambient2

at 200 ft./min., four layer

board - 2s2p

°C/W

RJB

D Junction-to-Board3

3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC

specification for the specified package.

°C/W

RJCtop

D Junction-to-Case4

4 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate

temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.

5°C/W

JT

D Junction-to-Package Top, Natural

Convection5

5 Thermal characterization parameter indicating the temperature difference between the package top and the

junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization

parameter is written as Psi-JT.

2°C/W

SPC5644AF0MLU2 Datasheet(PDF) 67 Page - Freescale Semiconductor, Inc

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