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AS1369 Datasheet(PDF) 4 Page - ams AG |
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AS1369 Datasheet(HTML) 4 Page - ams AG |
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4 / 22 page ![]() www.austriamicrosystems.com/LDOs/AS1369 Revision 1.7 3 - 21 AS1369 Datasheet - Absolute Maximum Rat i ngs 5 Absolute Maximum Ratings Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 2. Absolute Maximum Ratings 1 1. The AS1369 uses an internal protective structure against light influence. However, exposing the WLP package to direct light could cause device malfunction. Parameter Min Max Units Comments Electrical Parameters Input Supply Voltage -0.3 +7 V Shutdown Input Voltage -0.3 +7 V Output Voltage -0.3 +7 V IOUT Short-circuit protected Input/Output Voltage 2 2. The output PNP structure contains a diode between pins VIN and VOUT that is normally reverse-biased. reversing the polarity of pins VIN and VOUT will activate this diode. -0.3 +7 V Latch-Up -100 +100 mA Norm: JEDEC 78 Electrostatic Discharge ESD 2 kV Norm: MIL 883 E method 3015 500 V CDM JESD22-C101C methods Temperature Ranges and Storage Conditions Thermal Resistance, JA 3 3. Exceeding the maximum allowable dissipation will cause excessive device temperature and the regulator will go into thermal shutdown. 345 ºC/W The maximum allowable power dissipation is a function of the maximum junction temperature (TJ(MAX), the junction-to- ambient thermal resistance ( JA), and the ambient temperature (TAMB). The maximum allowable power dissipation at any ambient temperature is calculated as: P(MAX) = (TJ(MAX) - (TAMB))/ JA (EQ 1) Where: The value of JA for the WLP package is 345°C/W. Operating Junction Temperature -40 +125 ºC Storage Temperature Range -65 +150 ºC Package Body Temperature +260 ºC The reflow peak soldering temperature (body temperature) specified is in accordance with IPC/JEDEC J-STD-020 “Moisture/Reflow Sensitivity Classification for Non-Hermetic Solid State Surface Mount Devices”. |
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