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AS5263

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 6 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Symbol

Parameter

Min

Max

Units

Comments

Electrical Parameters

DC supply voltage at pin VDD

Overvoltage

-18

27

V

No operation

Output voltage OUT

-0.3

27

V

permanent

Output voltage KDOWN

-0.3

27

V

VDD3

DC supply voltage at pin VDD3

-0.3

5

V

VDD5

DC supply voltage at pin VDD5

-0.3

7

V

Input current (latchup immunity)

-100

100

mA

Norm: JEDEC 78

Electrostatic Discharge

ESD

Electrostatic discharge

±4

kV

Norm: MIL 883 E method 3015

This value is applicable to pins VDD, GND, OUT,

and KDOWN.

All other pins ±2 kV.

Temperature Ranges and Storage Conditions

Storage temperature

-55

+150

ºC

Min -67ºF; Max +257ºF

Body temperature (Lead-free package)

260

ºC

t=20 to 40s,

The reflow peak soldering temperature (body

temperature) specified is in accordance with

IPC/JEDEC J-STD-020 “Moisture/Reflow

Sensitivity Classification for Non-Hermetic Solid

State Surface Mount Devices”.

The lead finish for Pb-free leaded packages is

matte tin (100% Sn).

H

Humidity non-condensing

585

%

MSL

Moisture Sensitive Level

3

Represents a maximum floor life time of 168h